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TapeUP 拟基于新版晶体管铸造做 ITOTapeUP Plans ITO on the New Transistor Minting

TapeUP 计划基于 TapeOut 新版晶体管铸造功能搭建 ITO,把发行与参与流程放到晶体管与电路之上,使其成为可以发行项目、承接应用的底座。按新版规则,处理器的晶体管 Mint 统一用 BEM 支付,单价由创建者以 BEM 设定。TapeUP 表示具体规则尚未公布,先看第一个通过 ITO 发行的项目形态。TapeUP plans to build an ITO on TapeOut's new transistor minting feature, layering issuance and participation flows on top of transistors and circuits so they become a base for launching projects and hosting applications. Under the new rules, processor transistor mints are paid uniformly in BEM, with the unit price set by the creator in BEM. TapeUP says detailed rules are not yet published and it will first watch what the first ITO-issued project looks like.

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