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TapeOut V2 组件插槽:模块、铸造、销毁与分成闭环TapeOut V2 Component Slot: module submission, mint, burn, and revenue share

社区对 TapeOut V2 设计作出进一步梳理:开发者可提交 BNN、LUT、加法器或密码学模块,审核通过后进入元件仓库;工厂销毁 BEM 购买设备与生产能力,用户铸造元件并进入 Circuit,开发者从元件使用中获取分成。该流程形成 PoD 排放 BEM、工厂销毁购设备、用户铸件、Circuit 消耗的闭环。作者提示,V2 为已公布并获创始人确认的设计方向,主网合约与完整代码尚未独立验收。The community further detailed the TapeOut V2 design: developers can submit BNN, LUT, adder, or cryptographic modules, which enter a component repository after review; factories burn BEM to purchase equipment and production capacity, users mint components that enter Circuits, and developers earn a share from component usage. This forms a loop of PoD emitting BEM, factories burning BEM for equipment, users minting components, and Circuit consumption. The author noted that V2 is a confirmed design direction announced with founder approval, while mainnet contracts and full code have not yet undergone independent audit.

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